Industrial Motherboards and High-Performance Edge Computing Solutions on Display
August 15, 2025 – TAIPEI, TAIWAN – BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, is excited to announce its collaboration with NETIO, a Taiwanese IPC solution provider, to enhance the global distribution of BIOSTAR's EdgeComp product line.
As part of this strategic partnership, BIOSTAR and NETIO will jointly participate in TAIWAN EXPO USA 2025, held from August 14 to 16 at the Kay Bailey Hutchison Convention Center in Dallas, Texas (Hall A, Booth #313).
This collaboration aims to expand the reach of integrated edge computing solutions tailored for a wide array of industrial applications, including, smart manufacturing, smart city, smart retail, and intelligent control systems. Attendees at Taiwan Expo USA will experience firsthand the synergy of BIOSTAR's cutting-edge hardware and NETIO's system integration expertise.
At the expo, BIOSTAR and NETIO will showcase a robust lineup of industrial motherboards and edge computing systems designed for demanding industrial environments. Featured motherboards include the BIADN-IHT, BITWL-150, BIRPL-PAT, and BIW88-AHS compact, reliable solutions built for automation controllers, industrial imaging systems, and real-time data processing.
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Complementing these boards are BIOSTAR's latest fanless edge systems: the EdgeComp MS-X7433RE, ideal for rugged edge computing deployments with extended temperature operation, and the EdgeComp MS-1335U, a slim, energy-efficient embedded IPC perfect for smart kiosks, industrial gateways, and digital signage. Together, these products represent a versatile edge computing portfolio that meets the evolving needs of modern industry.
BIOSTAR and NETIO warmly invite all attendees, industry partners, and media representatives to visit Booth #313 at TAIWAN EXPO USA 2025 to explore their latest edge computing solutions. This is an excellent opportunity to connect directly with both teams, experience product demonstrations, and discuss collaboration opportunities in industrial edge computing, smart city, smart retail, and smart manufacture solutions.
